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F&S Bondtecs universal wire bonder offers a maximum in flexibility because of its many interchangeable bond heads. This allows us to solder single and ribbon wires made out of materials ranging from copper over aluminum to gold, depending on what kind of laser diodes have to be connected. With this bonding machine we can work accurately and reliable, whether the task is to bond manually or fully automated, single- or multi-wire. The bonder can quickly be transformed into a pull- or shear-tester for quality control purposes.

For more information or further questions please ask our staff:

Sven Schwertfeger
CTO
✉ sven.schwertfeger@berlin-bfb.de
☎ +49 (0) 30/6392 8149