The BL 2000 is an automatic bonding machine that specializes in soldering semiconductor laser chips onto headspreaders and –sinks. It is equipped with six moving axes to adjust soldering parts, placement precision is around one micrometer. All components are picked independently out of storage by a vacuum lifter and stacked on top of a soldering oven. To this end a camera system catches geometries and forms of all components and the control software calculates movement parameters by itself. Several additional position sensors measure soldering surfaces to achieve the necessary accuracy and parallelism needed for diode lasers bonds. The temperature sequence during heating is tailored to the specific solder being used. Furthermore there is an integrated forming gas unit that prevents oxidation. With that BFB is in control of a flexible and fully automatic system for soldering laser diodes on heatsinks.
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